LED COB, with LED standing for light-emitting diode and COB for chip on board, is a kind of lighting source using COB technology to improve light efficiency and reduce loss.
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The LED COB chip-on-board technology is one of the most cutting-edge LED technologies in the lighting industry. It is an assembly method that directly mounts an array of diodes on a single substrate or a printed circuit board. Thanks to the assembly style, it appears like a lighting panel. No matter how many diodes are there, this design needs only one circuit and two contacts. Such configuration can accommodate nine or even more diodes on one chip, thus taking up less place while producing more brightness. Compared with older lights, it is relatively compact, efficient, and bright.
The gap between each diode is fairly narrow that the whole size of the LED COB light is quite compact. This provides great flexibility for utilizing it in diverse places.
In comparison to older lightings, COB LED chip has a higher watt ratio. It produces a large number of lumens per watt that can reach 100 while traditional one can only offer 20-50 lumens per watt.
The brightness comes from it is comparatively uniform. When illuminating a subject, it brings a clean and distinct shadow outline. This makes it well suited for creating special lighting effects in shooting, thus it gains popularity from photographers and filmmakers.
Because an array of light emitting diodes is mounted on one substrate, the density is higher than other LED chips, which means strong light intensity.
Because of design simplicity, COB light contains fewer components than traditional ones. Hence, the heat generated by the components is relatively low compared to conventional lights.
When talking about LEDs, what comes to people's mind is probably the Dual In-Line Package LED that consists of a chip built in a cylindrical hard plastic. It is the most conventional one but it is bulky and not efficient.
Actually, thanks to the rapid technology development, more efficient and more powerful LED COB and LED SMD become two main types of bulbs now. With SMD standing for Surface-Mounted Device, SMD LED light is composed of diode chips fused permanently on the circuit board. These two typical modules are often mentioned in the same breath. However, there are still many differences between them.
Chip LED COB can accommodate the LED COB array of more than 9 diodes while SMD LED can contain only 3 diodes. This accounts for the fact that the illumination of it is better than the one of surface-mounted device.
The former is generally capable of emitting 100 and above lumens per watt while the latter produces 50 to 100 lumens per watt.
LED COB panel merely has one circuit and two contacts, conducing to great simplicity and low failure rate for the whole device. Owing to the single circuit configuration, it needs multiple channel adjustments to realize the flexible effects of color. By contrast, SMD light has up to three individual circuits and six contacts on a single chip, which makes it not as compact as LED COB chip but capable of producing RGB results within one chip.
By the way, RGB stands for Red, Green, and Blue colors, which are added in a variety of ways to create multiple displays. In particular, the full intensity of each gives a White, and the quality of White depends on the primary light sources.
LED COB performs quite well in providing homogeneous illumination and SMD cannot achieve the same effect.
Generally speaking, the chip-on-board one can realize high-intensity homogeneous light emission while the other performs better in the flexibility of colors.
Professional manufacturers always utilize LED COB bulbs to make their products. Because of its luminous uniformity, you can use the portable COB LED light for photography and films. The COLBOR CL100 is such a good choice. It offers constant 100W output and features an intelligent temperature control system to ensure optimal working temperature.
Its unmatched compactness also provides great convenience for users to carry it around for outdoor and mobile filming especially when it is a COB rechargeable light.
Industrial sites like mining industries, car factories, and warehouses are typical examples that need those with high-density lumens for a coverage of large area. High intensity and great uniformity make COB chips well suited for this case.In the architectural field, LED COB is widely used for sophisticated display. It is convenient to use reflectors to control the light beam. COB ceiling lights and downlights are commonly seen in residential design. They are so lightweight that they can be easily installed without damaging the aesthetics of the ceilings. In addition, COB LED flex strips are often used to decorate the outer walls of the buildings.In agricultural and horticultural fields, chip-on-board grow light is popular because it contributes to the better growth and higher output of plants, vegetables, and flowers indoor.All in all, with great efficiency and outstanding effects, the LED COBs gain a foothold in the industry. It is palpable that it might become the future of lighting.
COB packaging integrates upstream chip technology, midstream packaging technology and downstream display technology. Therefore, COB packaging requires close cooperation between upstream, midstream and downstream companies to promote the large-scale application of COB LED displays.
As shown in the figure above, it is a COB integrated package LED display module. The front side is composed of LED lamp modules to form pixels, and the bottom side is an IC driving element. Finally, each COB display module is spliced ??into a design-sized LED display.
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Theoretical advantages of COB:
1. Design and development: Without the diameter of a single lamp body, it can be made smaller in theory;
2. Technical process: reduce bracket cost and simplify manufacturing process, reduce chip thermal resistance, and realize high-density packaging;
3. Engineering installation: From the application side, the COB LED display module can provide manufacturers of display screen users with a simpler and faster installation efficiency.
4. Product features:
(1) Ultra-light and thin: According to the actual needs of customers, PCB boards with a thickness from 0.4 to 1.2 mm can be used to reduce the weight at least to 1/3 of the original traditional products, which can significantly reduce the structure, transportation and engineering costs.
(2) Anti-collision and compression: COB products directly encapsulate the LED chip in the concave lamp position of the PCB board, and then encapsulate and cure it with epoxy resin. The surface of the lamp point is convex into a spherical surface, which is smooth and hard, and is resistant to crash.
(3) Large viewing angle: the viewing angle is greater than 175 degrees, close to 180 degrees, and has a better optical diffuse color haze effect.
(4) Strong heat dissipation capability: COB products encapsulate the lamp on the PCB board, and quickly transfer the heat of the wick through the copper foil on the PCB board. Moreover, the thickness of the copper foil of the PCB board has strict process requirements, plus the sink that the gold process hardly causes serious light attenuation. So there are few dead lights, which greatly extends the life of the LED display.
(5) Wear-resistant and easy to clean: The surface is smooth and hard, impact-resistant and wear-resistant; there is no mask, and it can be cleaned with water or cloth when there is dust.
(6) Excellent all-weather characteristics: triple protection treatment, outstanding waterproof, moisture, corrosion, dust, static electricity, oxidation, and ultraviolet effects; meeting all-weather working conditions, and the temperature difference environment of minus 30 degrees to minus 80 degrees can still be used normally.
It is for these reasons that COB packaging technology has been pushed to the forefront in the display field.
Current COB technical problems:
At present, COB's accumulation in the industry and process details need to be improved, and some technical problems are also facing.
1. The one-time pass rate of the package is not high, the contrast is low, and the maintenance cost is high;
2. The color uniformity is far inferior to the display screen after the SMD device with light and color separation.
3. The existing COB package still uses the formal chip, which requires die bonding and wire bonding. Therefore, there are many problems in the wire bonding process and the process difficulty is inversely proportional to the pad area.
4. Manufacturing cost: Due to the high defect rate, the manufacturing cost far exceeds the small pitch of SMD.
Based on the above reasons, although the current COB technology has made certain breakthroughs in the display field, it does not mean that SMD technology has completely withdrawn and declined. In the field of dot pitch above 1.0mm, SMD packaging technology relies on its mature and stable product performance. Extensive market practice and perfect installation and maintenance guarantee system are still the leading role, and they are also the most suitable selection direction for users and the market.
With the gradual improvement of COB product technology and the further evolution of market demand, the large-scale application of COB packaging technology in the interval of 0.5mm to 1.0mm will reflect its technical advantages and value. To borrow a word from the industry saying: "COB package is tailor-made for 1.0mm and below dot pitch."
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