The process requirements in the PCB production are very important, which directly determines the quality and positioning of a board. Such as HASL, gold plating pcb , ENIG.
The process requirements in the PCB production are very important, which directly determines the quality and positioning of a board. Such as HASL, gold plating pcb , ENIG.
Lead-Free HASL is similar to standard HASL, but with an obvious difference… It doesn't use Tin-Lead solder. Instead, Tin-Copper, Tin-Nickel or Tin-Copper-Nickel Germanium may be used. This makes Lead-Free HASL an economical and RoHS compliant choice.
Due to the good quality of ENIG, the price is higher too. Many customers choose the most common HASL process.
1. On the surface, Lead-tin is brighter and lead-free tin (SAC) is dim.
2. Lead in HASL is harmful to humans, but lead-free not. The lead eutectic temperature is lower than lead-free, which depend on Lead-free alloy composition. For example, The eutectic of SNAGCU is 217 degrees, the pcb soldering temperature is eutectic temperature plus 30 to 50 degrees. The lead eutectic is 183 degrees. The mechanical strength and brightness with lead is better than lead-free.
3. lead-free HASL. Lead-free HASL is an environmentally friendly process. It is very harmful to the human body. It is also a process advocated at this stage. The lead content in lead-free tin is not more than 0.5, and the lead-free HASL has a high melting point, so that the solder joint is firm. In essence, lead spray tin and lead-free tin spray are a process. Only the purity of lead is different. Lead-free tin is a more environmentally friendly and safer environment for the human body, and it is also a development trend in the future. It is recommended that you use it. The characteristics and shortcomings of the two types of process hasl and lead-free hasllead-free hasl are introduced. Among them, hasl is easy to use, but it is unsafe, environmentally friendly and harmful to the human body. Therefore, it is recommended to use lead-free hasl, non-toxic and harmless, is also the surface treatment process currently advocated.
The simplest definition of the difference between the two is that one does not use lead, while the other does. However, there are some interesting differences between HASL with lead and HASL without lead finishes.
The following are some of the factors that make the difference:
1. Thickness of the support
The thickness of the circuit board makes the difference between the HASL with lead and the HASL without lead. The leaded support PCB thickness ranges between 25.4µm and 50.8µm; the lead-free variant supports thicknesses between 2.54µm and 25.4µm.
2. Cost of surface treatment
Lead-free HASL has an intermediate cost compared to other PCB finishes such as ENIG and HASL. It is less expensive than the ENIG surface treatment and somewhat more expensive than the traditional HASL process.
3. Properties
The properties or composition also make the two different; HASL lead uses a combination of tin and lead, while lead-free HASL uses more tin and less copper.
4. Typical applications
The surface finish of HASL lead is ideal for use in circuit boards where a greater thickness is required. For example, it can be used for simple/traditional flame retardant (FR4) PCBs, especially those over 0.5 mm thick.
The HASL lead-free surface treatment can be used for circuit boards with a thickness of less than 0.5 mm. An example is rigid printed circuit boards (PCBs).
5. Safety precautions
It makes no sense to use products that cause harm to humans or the environment. this is the case with HASL leaded PCB finishes, which use lead as one of their characteristics. This causes bodily harm and can lead to environmental problems.
The opposite is the case with lead-free HASL finishes, which do not use lead as one of the solder alloys. This makes it safer for both the person using it and the environment in which it is used.
6. Melting point
Just as HASL lead-free uses a higher temperature, this also means that a lot of time must pass before its solder melts. In contrast, with the HASL lead finish, the solder melts much more quickly.
7. Presentation
The presentation of the surface treatment also distinguishes between HASL lead-free and HASL leaded. Commonly, HASL surface finishes consisting of lead and tin have a brighter interface due to the brighter and shiny composition of the properties.
In contrast, lead-free HASL finishes tend to appear dull when applied to the surface of PCBs.
Lead-Free HASL is similar to standard HASL, but with an obvious difference… It doesn't use Tin-Lead solder. Instead, Tin-Copper, Tin-Nickel or Tin-Copper-Nickel Germanium may be used. This makes Lead-Free HASL an economical and RoHS compliant choice.
Due to the good quality of ENIG, the price is higher too. Many customers choose the most common HASL process.
1. On the surface, Lead-tin is brighter and lead-free tin (SAC) is dim.
2. Lead in HASL is harmful to humans, but lead-free not. The lead eutectic temperature is lower than lead-free, which depend on Lead-free alloy composition. For example, The eutectic of SNAGCU is 217 degrees, the pcb soldering temperature is eutectic temperature plus 30 to 50 degrees. The lead eutectic is 183 degrees. The mechanical strength and brightness with lead is better than lead-free.
3. lead-free HASL. Lead-free HASL is an environmentally friendly process. It is very harmful to the human body. It is also a process advocated at this stage. The lead content in lead-free tin is not more than 0.5, and the lead-free HASL has a high melting point, so that the solder joint is firm. In essence, lead spray tin and lead-free tin spray are a process. Only the purity of lead is different. Lead-free tin is a more environmentally friendly and safer environment for the human body, and it is also a development trend in the future. It is recommended that you use it. The characteristics and shortcomings of the two types of process hasl and lead-free hasl are introduced. Among them, hasl is easy to use, but it is unsafe, environmentally friendly and harmful to the human body. Therefore, it is recommended to use lead-free hasl, non-toxic and harmless, is also the surface treatment process currently advocated.
The simplest definition of the difference between the two is that one does not use lead, while the other does. However, there are some interesting differences between HASL with lead and HASL without lead finishes.
The following are some of the factors that make the difference:
1. Thickness of the support
The thickness of the circuit board makes the difference between the HASL with lead and the HASL without lead. The leaded support PCB thickness ranges between 25.4µm and 50.8µm; the lead-free variant supports thicknesses between 2.54µm and 25.4µm.
2. Cost of surface treatment
Lead-free HASL has an intermediate cost compared to other PCB finishes such as ENIG and HASL. It is less expensive than the ENIG surface treatment and somewhat more expensive than the traditional HASL process.
3. Properties
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The properties or composition also make the two different; HASL lead uses a combination of tin and lead, while lead-free HASL uses more tin and less copper.
4. Typical applications
The surface finish of HASL lead is ideal for use in circuit boards where a greater thickness is required. For example, it can be used for simple/traditional flame retardant (FR4) PCBs, especially those over 0.5 mm thick.
The HASL lead-free surface treatment can be used for circuit boards with a thickness of less than 0.5 mm. An example is rigid printed circuit boards (PCBs).
5. Safety precautions
It makes no sense to use products that cause harm to humans or the environment. this is the case with HASL leaded PCB finishes, which use lead as one of their characteristics. This causes bodily harm and can lead to environmental problems.
The opposite is the case with lead-free HASL finishes, which do not use lead as one of the solder alloys. This makes it safer for both the person using it and the environment in which it is used.
6. Melting point
Just as HASL lead-free uses a higher temperature, this also means that a lot of time must pass before its solder melts. In contrast, with the HASL lead finish, the solder melts much more quickly.
7. Presentation
The presentation of the surface treatment also distinguishes between HASL lead-free and HASL leaded. Commonly, HASL surface finishes consisting of lead and tin have a brighter interface due to the brighter and shiny composition of the properties.
In contrast, lead-free HASL finishes tend to appear dull when applied to the surface of PCBs.
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